Tungsten copper alloy not only has the low expansion characteristic of tungsten, but also has the high thermal conductivity characteristic of copper. By changing the proportion of tungsten and copper, the thermal expansion coefficient and thermal conductivity function of tungsten and copper alloy are changed, so the application field of tungsten and copper alloy is more extensive. Tungsten copper alloy is widely used in semiconductor materials due to its good physical and mechanical properties, good ability to conduct current, and similar thermal expansion coefficient with silicon wafers and ceramic materials.
The uniqueness of tungsten copper electroplating is that it is recommended to carry out aging test according to existing electroplating technology and electroplating samples before electroplating. The electroplated tungsten-copper alloy is placed in a vacuum furnace at 800℃ and treated with heat preservation for about 20 minutes.
If no adverse reactions such as bubbles and discoloration are found in the tungsten copper alloy after the oven, it indicates that there is no problem with the electroplating technology, and tungsten-copper electroplating can be carried out according to this technology. In case of adverse reactions such as bubbles and discoloration of tungsten-copper alloy, please stop the use of this technology to avoid the waste of resources. Please consult with professional electroplating personnel to discuss the improvement plan. Because tungsten copper alloy is formed by the combination of tungsten and copper, and the metal tungsten is insoluble with other metals, so it is difficult to carry out electroplating technology.
About the electroplating method of tungsten-copper alloy: Tungsten copper alloy must be cleaned before electroplating, using ultrasonic and neutral cleaning liquid, the impurities on the tungsten-copper surface will be cleaned, in order to increase the adhesion strength of the tungsten-copper surface. But it must be noted that the cleaning agent is prohibited to use strong acid and alkali substances. In addition, before cleaning and electroplating technology, the interval between the two should not be too long. After cleaning, electroplating should be carried out immediately.
Post time: Jul-26-2022